AMD Phenom II X4 955BE

Back at the beginning of the year, AMD launched a new flagship for its desktop processors. Being part of the Phenom II series, the x4 940 clocked at 3.0GHz revealed to be a great performer and overclocker. Later in February, a new batch of Phenom IIs had been launched. It consisted of the 2.6GHz x3 710, the 2.8GHz x3 720 Black Edition and the 2.6GHz x4 810. The memory controller of these processors supports DDR3 when used in an AM3 motherboard compared to the x4 940 which is limited to the AM2+ socket with DDR2.

Although it was initially speculated that AMD would increase the L3 cache of these new Phenom processors from 6MB to 8MB, this has not been the case, and the Phenom II X4 955 still carries the same 6MB as its predecessors. The processor is however reaching new heights for AMD in terms of operating frequency, designed to work at 3.2GHz, it's fastest clocked quad-core processor the company has ever released.

Model Number & Core Frequency	X4 955 Black Edition = 3.2GHz
Model Number & Core Frequency	X4 945 = 3.0GHz
X4 955 Black Edition OPN	TRAY OPN#  HDZ955FBK4DGI PIB OPN#  HDZ955FBGIBOX
X4 945 OPN	TRAY OPN#  HDX945FBK4DGI PIB OPN#  HDX945FBGIBOX
L1 Cache Sizes	64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per processor)
L2 Cache Sizes	512KB of L2 data cache per core (2MB total L2 per processor)
L3 Cache Size	6MB (shared)
Total Cache (L2+L3)	8MB
Memory Controller Type	Integrated 128-bit wide memory controller
Memory Controller Speed	Up to 2.0GHz with Dual Dynamic Power Management
Types of Memory Supported	Unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
HyperTransport 3.0 Specification	One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
Total Processor-to-System Bandwidth	Up to 37.3GB/s total bandwidth [Up to 21.3 GB/s memory bandwidth (DDR3-1333) + 16.0GB/s (HT3)] Up to 33.1GB/s total bandwidth [Up to 17.1 GB/s memory bandwidth (DDR2-1066) + 16.0GB/s (HT3)]
Packaging	Socket AM3 938-pin organic micro pin grid array (micro-PGA)
Fab location	GLOBALFOUNDARIES Fab 1 module 1 in Dresden, Germany (formerly AMD Fab 36)
Process Technology	45-nanometer DSL SOI (silicon-on-insulator) technology
Approximate Die Size	258 mm2
Approximate Transistor count	~ 758 million
Max Temp	62o Celsius
Nominal Voltage	0.875-1.5V
Max TDP	125 Watts